Apparatus to perform a non-contact test of a semiconductor package

A semiconductor package testing apparatus comprising:

• a inclined illuminator installed above a measurement target and having a hemispheric shape, the inclined illuminator having a plurality of light emitting diodes (LEDs) disposed on a portion other than an opening formed in the center thereof to supply inclined illumination to the measurement target;
• an inclined image capture unit configured to receive reflection light reflected by the measurement target and capture a side image of the measurement target;
• a reflection mirror installed at a tilt angle on one side of the inclined image capture unit to guide the reflection light reflected by the measurement target into the inclined image capture unit;
• and
• a condensing lens installed in front of the inclined image capture unit and configured to condense incident reflection light.

A testing apparatus, comprising:

• a first illumination device to illuminate a target area of a tested device, the first illumination device providing illumination to the target area such that light from the first illumination device contacts the target area along an axis parallel to a center length axis of the tested device;
• a second illumination device to illuminate a target area of a tested device, the second illumination device providing illumination to the target area such that light from the second illumination device contacts the target area along an axis that is not parallel to a center length axis of the tested device;
• a first image capture device to receive light from the first illumination device reflected off of the target area;
• and
• a second image capture device to receive light from the second illumination device reflected off of the target area,
• wherein the center length axis of the tested device defines a first direction.