US 2010/0141250 A1 · MAGNETIC SENSOR MODULE

Abstract

In a magnetic sensor module, using die-bond resin as a joining material, a Z-axis magnetic sensor is mounted onto a substrate having a wire formed on its principal surface. The Z-axis magnetic sensor having electrode pads formed on its bottom surface is tilted by 90 degrees and mounted onto the substrate. Therefore, the electrode pads are positioned at a side surface thereof. A joining material accommodation area which the die-bond resin can fill is provided at the surface of the Z-axis magnetic sensor opposing the principal surface of the substrate. This joining material accommodation area has a grooved structure. At the surface of the Z-axis magnetic sensor opposing the principal surface of the substrate, the grooved structure is provided at an end portion near the wire formed on the substrate.

Claims4

Dependent claims

A magnetic sensor module comprising:

a substrate having a wire on a principal surface thereof;
a magnetic sensor having an electrode pad formed on one surface thereof, the magnetic sensor being mounted on the principal surface of the substrate using a first joining material so that another surface thereof orthogonal to the one surface opposes the principal surface of the substrate, the magnetic sensor having a joining material accommodation area that is situated between the electrode pad and the another surface and that is capable of being filled with the first joining material;
and
and a second joining material electrically connecting the wire and the electrode pad to each other.

1 more element

Dependencies are inferred from the claim text.

Magnetic sensor module

Life of this patent

Magnetic sensor module

Life of this patent

Abstract

Claims4