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US 2010/0140812 A1Published application
Semiconductor device
AssigneeElpida Memory, Inc.
InventorSeiya FUJII
Life of this patent
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Abstract
Semiconductor device 1 according to the present invention includes wiring board 8 having mounting surface 8a mounted with laminated semiconductor chips 2 and plural semiconductor chips 2 mounted on mounting surface 8a of wiring board 8. Plural semiconductor chips 2 mounted on mounting surface 8a of wiring board 8 include second semiconductor chips 2b with circuit formation surfaces 3 directed to the mounting surface 8a side of wiring board 8 and first semiconductor chips 2a with circuit formation surfaces 3 directed to the opposite side of the mounting surface 8a side of wiring board 8.
Claims4
A semiconductor device comprising:
- a wiring board having a mounting surface on which laminated semiconductor chips are mounted;
- and
- a plurality of the semiconductor chips mounted on the mounting surface of the wiring board, wherein
- the plurality of the semiconductor chips mounted on the mounting surface of the wiring board include first semiconductor chips with circuit formation surfaces, on which circuits are formed, directed to an opposite side of the mounting surface side of the wiring board, and second semiconductor chips with the circuit formation surfaces directed to the mounting surface side of the wiring board.
1 more element
Dependencies are inferred from the claim text.