Integrated circuit packaging system with a protrusion on an inner stacking module and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsSeng Guan Chow, Rui Huang, Heap Hoe Kuan
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing an inner stacking module die; encapsulating the inner stacking module die with an inner stacking module encapsulation to form an inner stacking module, the inner stacking module encapsulation having an inner stacking module protrusion having a planar protrusion surface; and encapsulating at least part of the inner stacking module encapsulation with an encapsulation having a flat top coplanar with the planar protrusion surface or fully encapsulating the inner stacking module encapsulation.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing an inner stacking module die;
- encapsulating the inner stacking module die with an inner stacking module encapsulation to form an inner stacking module, the inner stacking module encapsulation having an inner stacking module protrusion having a planar protrusion surface;
- and
- encapsulating at least part of the inner stacking module encapsulation with an encapsulation having a flat top coplanar with the planar protrusion surface or fully encapsulating the inner stacking module encapsulation.
A method of manufacture of an integrated circuit packaging system comprising:
- providing an inner stacking module die;
- encapsulating the inner stacking module die with an inner stacking module encapsulation to form an inner stacking module, the inner stacking module encapsulation having an inner stacking module protrusion having a planar protrusion surface;
- mounting the inner stacking module over a substrate;
- connecting the inner stacking module to the substrate with a bond wire;
- and
- encapsulating at least part of the inner stacking module encapsulation with an encapsulation having a flat top coplanar with the planar protrusion surface or fully encapsulating the inner stacking module encapsulation.
An integrated circuit packaging system comprising:
- an inner stacking module die;
- an inner stacking module encapsulation encapsulating the inner stacking module die to form an inner stacking module, the inner stacking module encapsulation having an inner stacking module protrusion having a planar protrusion surface;
- and
- an encapsulation encapsulating at least part of the inner stacking module encapsulation having a flat top coplanar with the planar protrusion surface or fully encapsulating the inner stacking module encapsulation.
Dependencies are inferred from the claim text.