Power Distribution In A Vertically Integrated Circuit
AssigneeInternational Business Machines Corporation
InventorsTodd Alan Christensen, John Edward Sheets, II
Life of this patent
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Abstract
A first through via is electrically insulated from surrounding wafer substrate material. A second through via is not electrically insulated from the surrounding wafer substrate material. This configuration is advantageous when the non-insulated via serves as the path for either Vdd or GND. By not insulating the through via, a first supply voltage (Vdd or GND) is allowed to flow through the surrounding wafer substrate material thereby decreasing the resistance of the first supply voltage path.
Claims20
A method of manufacture for a microelectronic device comprising:
- providing a first wafer comprising a non-insulated via surrounded by substrate material;
- and
- providing for a first voltage to be transferred from the first wafer to a second wafer through the non-insulated via and the substrate material.
A electronic device comprising:
- an non-insulated via within a substrate layer of a first wafer that provides an electrical connection to a second wafer where a first voltage may be provided through the non-insulated via and through the substrate layer surrounding the non-insulated via.
Dependencies are inferred from the claim text.