Semiconductor device, and method of manufacturing multilayer wiring board and semiconductor device

A semiconductor device comprising:

• a semiconductor chip having electrode pads formed on its back surface;
• and
• a multilayer wiring board having connection pads formed on its front surface, each of which faces the corresponding electrode pad;
• wherein the electrode pads include:
• first electrode pads including electrode pads respectively disposed in the vicinity of corners of the back surface of the semiconductor chip;
• and second electrode pads other than the first electrode pads,
• the connection pads include:
• first connection pads connected to the first electrode pads via bumps;
• and second connection pads connected to the second electrode pads via bumps,
• the multilayer wiring board includes:
• a first insulating layer constituting a first insulating region for supporting the first connection pads;
• and a second insulating layer constituting a second insulating region for supporting the second connection pads, and
• the first insulating layer is stacked on the second insulating layer.

A method of manufacturing a multilayer wiring board, comprising the steps of:

• forming a circuit pattern on a core substrate containing glass cloth;
• forming a lower insulating layer of a thermosetting resin on the core substrate on which the circuit pattern is formed;
• forming, on the lower insulating layer, a circuit pattern and a plurality of pads connected electrically to the circuit pattern formed on the core substrate;
• forming, on the lower insulating layer on which the circuit pattern is formed, an upper insulating layer of a thermoplastic resin in such a manner that the upper insulating layer surrounds the pads as a group;
• and
• forming, on the upper insulating layer, a plurality of pads connected electrically to the circuit pattern formed on the lower insulating layer.