Device mounting board and method of manufacturing the board, semiconductor module and method of manufacturing the module
OwnerYasuyuki YANASE, Koichi SAITOinventors
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Abstract
A device mounting board is provided with: an insulating resin layer; a wiring layer provided on one major surface of the insulating resin layer; and a bump electrode electrically connected to the wiring layer and configured to be projected from the wiring layer toward the insulating resin layer. The bump electrode has an approximately convex-shaped top surface and at least the peripheral area on the top surface thereof is curve-shaped.
Claims10
A device mounting board comprising:
- an insulating resin layer;
- a wiring layer provided on one major surface of the insulating resin layer;
- and
- a bump electrode electrically connected to the wiring layer and configured to be projected from the wiring layer toward the insulating resin layer, wherein the bump electrode has an approximately convex-shaped top surface and at least the peripheral area on the top surface is curve-shaped.
A semiconductor module comprising:
- a device mounting board provided with an insulating resin layer, a wiring layer provided on one major surface of the insulating resin layer, and a bump electrode electrically connected to the wiring layer and configured to be projected from the wiring layer toward the insulating resin layer;
- and
- a semiconductor device provided with a device electrode connected to the bump electrode, wherein the distance between the bump electrode and the device electrode in the peripheral area of a joint portion between the two electrodes, becomes gradually larger from the joint portion toward outside.
A method of manufacturing a device mounting board in which an insulating resin layer and a wiring layer are laminated, the method comprising:
- preparing a metal plate for the wiring layer, on one major surface of which a projection is provided;
- and
- forming a bump electrode configured to have an approximately convex-shaped top surface by performing plating on a top surface of the projection under a condition in which a plating reaction in the peripheral area on the top surface is suppressed, with the use of a mask from which the top surface of the projection is opened, so that a metallic layer having a curved shape, the thickness of the peripheral area of which is thinner than that of the central area, is provided on the top surface.
A method of manufacturing a semiconductor module, comprising:
- forming, on one major surfaces of a metal plate, a bump electrode configured to have an approximately convex-shaped top surface, and configured such that at least the peripheral area on the top surface is curve-shaped;
- pressure-bonding, via an insulating resin layer, the metal plate and a semiconductor device provided with a device electrode corresponding to the bump electrode, so that the bump electrode and the device electrode are joined together;
- and
- forming a wiring layer by selectively removing the metal plate.
Dependencies are inferred from the claim text.