Apparatus and method for packaging circuits

An apparatus comprising a grid array packaged die, comprising:

• an integrated circuit die comprising:
• a main body including a top layer, a bottom layer, and a peripheral surface extending between the top layer and the bottom layer;
• a bond pad on one of the layers of the main body;
• an edge contact at the peripheral edge surface, wherein the edge contact includes a bottom surface that is substantially in the same plane as a surface of an encapsulant at least partially encasing the die;
• and
• a line connecting the bond pad to the edge contact;
• and
• a contact pad on the layer of the main body that does not include the bond pad, the contact pad communicatively coupled to the edge contact.

An apparatus comprising a grid array packaged die, comprising:

• an integrated circuit die comprising:
• a main body including a top layer, a bottom layer, and a peripheral surface extending between the top layer and the bottom layer;
• a bond pad on one of the layers of the main body;
• an edge contact embedded in the peripheral edge surface;
• and
• a redistribution line on the bond pad layer connecting the bond pad to the edge contact;
• and
• a contact pad on the layer of the main body that does not include the bond pad, the contact pad communicatively coupled to the edge contact.

A wafer, comprising:

• a plurality of integrated circuit dice, wherein each integrated circuit die includes a bond pad;
• saw streets between adjacent pairs of the plurality of dice;
• an edge contact recessed in a saw street between an adjacent pair of the integrated circuit dice, wherein the edge contact does not extend above top surfaces of the pair of adjacent dice;
• a first electrically conductive line extending from a bond pad of a first die of the pair of dice to the edge contact;
• a second electrically conductive line extending from a bond pad of a second die of the pair of dice to the edge contact;
• and
• a passivation layer covering a portion of the wafer excluding the edge contact.