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US 2010/0140790 A1Published application
Chip having thermal vias and spreaders of cvd diamond
AssigneeSeagate Technology LLC
InventorsDadi Setiadi, Hongyue Liu
Life of this patent
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Abstract
An integrated circuit chip having a heat spreader comprising CVD diamond extending along the chip support body and thermal vias extending through the support body in regions free of active devices or functional elements. The thermal vias may thermally conductive and electrically conductive or may be thermally conductive and electrically resistive. The integrated circuit chips may be 3D integrated circuit chips.
Claims20
An integrated circuit chip comprising:
- a support body having thereon at least one active device;
- a heat spreader comprising CVD diamond extending along the support body;
- and
- at least one thermal via extending through the support body.
1 more element
An integrated circuit chip comprising:
- a support body having side edges and a thickness;
- a plurality of functional elements arranged on the support body to form regions free of functional elements;
- at least one thermal via extending through the thickness of the support body in the regions free of functional elements;
- and
- a heat spreader comprising CVD diamond extending to the side edges along the support body.
2 more elements
Dependencies are inferred from the claim text.