Integrated circuit packaging system with exposed terminal interconnects and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsArnel Senosa Trasporto, Lionel Chien Hui Tay, Zigmund Ramirez Camacho, Abelardo Jr. Hadap Advincula
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a lead; mounting an inner package so that the lead is peripheral to the inner package, and the inner package having a connection pad; forming an exposed terminal interconnect on the connection pad; and encapsulating the inner package, and partially encapsulating the exposed terminal interconnect with an encapsulation.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a lead;
- mounting an inner package so that the lead is peripheral to the inner package, and the inner package having a connection pad;
- forming an exposed terminal interconnect on the connection pad;
- and
- encapsulating the inner package, and partially encapsulating the exposed terminal interconnect with an encapsulation.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a lead;
- mounting a dual row inner package or a selectively balled inner package so that the lead is peripheral to the inner package, and the inner package having a connection pad;
- forming an exposed terminal interconnect on the connection pad;
- and
- encapsulating the inner package, and partially encapsulating the exposed terminal interconnect with an encapsulation to create a first selectively balled integrated circuit packaging system or a first dual row integrated circuit packaging system.
An integrated circuit packaging system comprising:
- a lead;
- an inner package having a connection pad mounted so that the lead is peripheral to the inner package;
- an exposed terminal interconnect formed on the connection pad;
- and
- an encapsulation that encapsulates the inner package, and partially encapsulates the exposed terminal interconnect.
Dependencies are inferred from the claim text.