Semiconductor power module package having external bonding area
AssigneeFairchild Korea Semiconductor Ltd.
InventorsKeun-hyuk LEE, Young-sun KO, Seung-won LIM, Man-kyo JUNG, Seung-yong CHOI
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Abstract
Provided is a semiconductor power module package including a bonding area on a direct bonding cupper (DBC) board. The semiconductor power module package includes: one or more semiconductor chips; a sealing member sealing the one or more semiconductor chips; a plurality of leads electrically connected to the one or more semiconductor chips and exposed from the sealing member; and an external bonding member electrically connected to the one or more semiconductor chips and electrically connecting an external circuit board exposed from the sealing member.
Claims20
A semiconductor power module package comprising:
- one or more semiconductor chips;
- a sealing member sealing the one or more semiconductor chips;
- a plurality of leads electrically connected to the one or more semiconductor chips and exposed from the sealing member;
- and
- an external bonding member electrically connected to the one or more semiconductor chips and electrically connecting an external circuit board exposed from the sealing member.
A semiconductor power module package comprising:
- an insulation substrate including one or more electrically separated conductive film patterns;
- a plurality of semiconductor chips on a plurality of first conductive film patterns of the one or more conductive film patterns;
- a sealing member formed on the upper and side surfaces of the insulation substrate and sealing the plurality of semiconductor chips and the one or more conductive film patterns;
- and
- a plurality of leads electrically connected to the plurality of semiconductor chips and exposed from the sealing member,
- wherein a plurality of second conductive film patterns of the conductive film patterns that are not disposed on the plurality of semiconductor chips include a plurality of external bonding areas that are electrically connected to an external circuit board and is exposed from the sealing member.
Dependencies are inferred from the claim text.