Semiconductor device
AssigneeInfineon Technologies AG
InventorsThomas Killer, Erich Syri, Gerold Gruendler, Juergen Hoegerl, Volker Strutz, Hermann Josef Lutz
Life of this patent
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Abstract
A method of assembling a semiconductor device includes providing a chip attached to an elastic carrier, and supporting the elastic carrier with a stiffener. The method additionally includes removing the stiffener from the elastic carrier after attaching the elastic carrier to a board.
Claims25
A method of assembling a semiconductor device comprising:
- providing a chip attached to an elastic carrier;
- supporting the elastic carrier with a stiffener;
- and
- removing the stiffener from the elastic carrier after attaching the elastic carrier to a board.
A method of handling a semiconductor module, the method comprising:
- attaching a chip to a flexible carrier;
- attaching at least one contact element to the flexible carrier;
- attaching a stiffener to the flexible carrier;
- handling the stiffener and attaching the at least one contact element to a board;
- and
- removing the stiffener from the flexible carrier such that the chip is flexibly mounted to the board.
A semiconductor device comprising:
- a circuit board;
- a elastic carrier comprising a first face opposite a second face, the first face attached to the circuit board with external contacts;
- and
- a semiconductor chip attached to the second face of the elastic carrier with chip contacts;
- wherein the elastic carrier configures the chip to move relative to the circuit board.
A semiconductor module configured for attachment to a circuit board, the semiconductor module comprising:
- an elastic carrier comprising a first face opposite a second face;
- external contacts attached to the first face of the elastic carrier;
- a semiconductor chip attached to the second face of the elastic carrier with chip contacts;
- and
- a stiffener removably coupled to the second face of the elastic carrier;
- wherein the stiffener is configured to minimize movement of the elastic carrier when attaching the external contacts to the circuit board.
Dependencies are inferred from the claim text.