Printed circuit board having built-in integrated circuit package and fabrication method therefor

A method for fabricating a Printed Circuit Board (PCB) with at least one built-in Integrated Circuit (IC) package having a plurality of conductive bumps on an IC for external electrical connection, the method comprising the steps of

• forming first and second conductive layers on upper and lower surfaces of a core insulation layer, respectively, forming a via hole for an electrical connection between the upper and lower surfaces, and selectively forming a core conductive layer circuit pattern;
• forming a first cavity opened in a first direction, for accommodating an IC package in the core insulation layer;
• accommodating the IC package in the first cavity so that a connection member is interposed between the conductive bumps and the first conductive layer;
• forming a contact hole by selectively eliminating the first and second conductive layers and the connection member in areas where the first and second conductive layers and the connection member overlap the conductive bumps, to expose the conductive bumps;
• and
• forming a connection wire in the contact hole to connect the conductive bumps to the first or second conductive layer.