Package, method of manufacturing the same and use thereof
AssigneeKoninklijke Philips Electronics N.V.
InventorsJohannes Wilhelmus Weekamp, Nicolaas Johannes Anthonius Van Keen
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AssigneeKoninklijke Philips Electronics N.V.
InventorsJohannes Wilhelmus Weekamp, Nicolaas Johannes Anthonius Van Keen
Estimating the term…
The flexible package (100) comprises coupling means (20) for electrical coupling to an external component, a chip (30) with contact pads (32) that face the coupling means (20) and are electrically coupled thereto, and an electrically insulating encapsulation (40) encapsulating the chip (30) and being attached to the coupling means (20), said encapsulation (40) and said coupling means (20) constituting a substrate for the chip (30). The package (100) further comprises means (50) for handling the package (100). This means (50) is mechanically connected to the coupling means (20) through the encapsulation (40) only. The package (100) is suitable for assembly to a foil, which may be attached to or integrated in an article such as a security paper.
A flexible package comprising coupling means for electrical coupling to an external component, a chip with contact pads that face the coupling means and are electrically coupled thereto, and an electrically insulating encapsulation encapsulating the chip and being attached to the coupling means, said encapsulation and said coupling means constituting a substrate for the chip, wherein means for handling the package are present that is mechanically connected to the coupling means through the encapsulation only.
A method of manufacturing a flexible package for a chip comprising the steps of:
An assembly of the package and a foil, said package comprising a carrier having means for external coupling, a chip that is attached to the carrier, and contact pads of which chip face the carrier and are electrically coupled to the carrier, and an encapsulation encapsulating the chip and attached to the carrier, said encapsulation extending in apertures in the carrier, said foil being attached to said carrier and said encapsulation extending in the apertures thereof.
An article comprising the assembly of any of the claims 14 and 15.
Dependencies are inferred from the claim text.