Semiconductor Package and Method of Forming Z-Direction Conductive Posts Embedded in Structurally Protective Encapsulant

A method of making a semiconductor package, comprising:

• providing a first carrier including a base plate and plurality of conductive posts;
• disposing an encapsulant over the base plate of the first carrier and around the conductive posts;
• mounting a semiconductor die to a second carrier;
• pressing the first and second carriers together to embed the semiconductor die in the encapsulant, the semiconductor die being disposed between the conductive posts in the encapsulant;
• removing the second carrier and base plate of the first carrier;
• and
• forming a first build-up layer over a first side of the encapsulant, the first build-up layer being electrically connected to the conductive posts.

A method of making a semiconductor package, comprising:

• providing a first carrier including a base plate and plurality of conductive posts;
• disposing an encapsulant over the base plate of the first carrier and around the conductive posts;
• pressing the first carrier over a semiconductor die to embed the semiconductor die in the encapsulant, the semiconductor die being disposed between the conductive posts in the encapsulant;
• removing the base plate of the first carrier;
• and
• forming a first build-up layer over a first side of the encapsulant, the first build-up layer being electrically connected to the conductive posts.

A semiconductor package, comprising:

• a plurality of conductive posts;
• an encapsulant disposed around the conductive posts;
• a semiconductor die disposed in the encapsulant between the conductive posts;
• a first build-up layer formed over a first side of the encapsulant, the first build-up layer being electrically connected to the conductive posts;
• and
• a second build-up layer formed over a second side of the encapsulant opposite the first side of the encapsulant, the second build-up layer being electrically connected to the conductive posts.