Integrated circuit packaging system using bottom flip chip die bonding and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsYoungJoon Kim, Ki Youn Jang
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate having a substrate cavity; mounting a bottom flip chip die below the substrate; mounting an internal integrated circuit die above the substrate; filling between the internal integrated circuit die and the substrate and between the bottom flip chip die and the substrate with a substance filling through the substrate cavity; and encapsulating the internal integrated circuit die with an encapsulation.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a substrate having a substrate cavity;
- mounting a bottom flip chip die below the substrate;
- mounting an internal integrated circuit die above the substrate;
- filling between the internal integrated circuit die and the substrate and between the bottom flip chip die and the substrate with a substance filling through the substrate cavity;
- and
- encapsulating the internal integrated circuit die with an encapsulation.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a substrate having a substrate cavity;
- mounting a bottom flip chip die below the substrate;
- mounting an internal integrated circuit die above the substrate;
- filling between the internal integrated circuit die and the substrate and between the bottom flip chip die and the substrate with a substance filling through the substrate cavity;
- mounting a structure over the internal integrated circuit die;
- connecting the structure to the substrate with bond wires;
- and
- encapsulating the internal integrated circuit die with an encapsulation.
An integrated circuit packaging system comprising:
- a substrate having a substrate cavity;
- a bottom flip chip die mounted below the substrate;
- an internal integrated circuit die mounted above the substrate;
- a substance in the substrate cavity that fills between the internal integrated circuit die and the substrate and between the bottom flip chip die and the substrate;
- and
- an encapsulation encapsulating the internal integrated circuit die.
Dependencies are inferred from the claim text.