Systems and processes for forming three-dimensional circuits

A system for forming a three-dimensional circuit on a substrate, comprising:

• a substrate comprising a first circuit layer, a second circuit layer, and an isolating layer interposed between the first and second circuit layers, wherein the second circuit layer communicates with the first circuit layer via a seed region exhibiting a crystalline surface, and the second circuit layer has an amorphous microstructure that exhibits electronic properties unsuitable for forming circuit features therein;
• the radiation source is adapted to produce a beam suitable for processing the second circuit layer;
• a stage adapted to support and move the substrate relative to the beam;
• and
• a controller is adapted to provide relative scanning motion between the stage and the beam to allow the beam to scan over the second circuit layer a rate effective to heat the second circuit layer and to initiate and propagate crystal growth from the seed region, thereby transforming the amorphous microstructure of the second circuit layer into a crystalline microstructure that exhibits electronic properties suitable for forming circuit features therein.

A system for forming a three-dimensional circuit on a substrate, comprising:

• a substrate comprising a first circuit layer, a second circuit layer, and an isolating layer interposed between the first and second circuit layers, wherein the first circuit layer has a transistor density associated with technology node of no greater than about 32 nanometers, the second circuit layer communicates with the first circuit layer via a seed region exhibiting a crystalline surface, and the second circuit layer has an amorphous microstructure that exhibits electronic properties unsuitable for forming circuit features therein;
• a stage supporting the substrate;
• and
• a radiation source adapted to heat the second circuit layer in a manner effective to initiate and propagate crystal growth from the seed region, thereby transforming the amorphous microstructure of the second circuit layer into a crystalline microstructure that exhibits electronic properties suitable for forming circuit features therein.

A process for forming a three-dimensional circuit on a substrate, comprising:

• (a) providing a substrate comprising a first circuit layer, a second circuit layer, and an isolating layer interposed between the first and second circuit layers, wherein the second circuit layer communicates with the first circuit layer via a seed region exhibiting a crystalline surface, and the second circuit layer has an amorphous microstructure that exhibits electronic properties unsuitable for forming circuit features therein;
• and
• (b) producing a beam suitable for processing the second circuit layer;
• and
• (c) scanning the beam over the second circuit layer a rate effective to heat the second circuit layer and to initiate and propagate crystal growth from the seed region, thereby transforming the amorphous microstructure of the second circuit layer into a crystalline microstructure that exhibits electronic properties suitable for forming circuit features therein.

A three-dimensional circuit structure, comprising:

• a first circuit layer;
• a second circuit layer, and
• an isolating layer interposed between the first and second circuit layers,
• wherein the second circuit layer communicates with the first circuit layer and has circuit features formed therein or a crystalline microstructure of a grain size greater than about one millimeter that exhibits electronic properties suitable for forming circuit features therein.