Component Stacking Using Pre-Formed Adhesive Films
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWeng-Jin Wu, Hung-Jung Tu, Ku-Feng Yang, Jung-Chih Hu, Wen-Chih Chiou
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Abstract
A method of forming integrated circuits includes laminating a patterned film including an opening onto a wafer, wherein a bottom die in the wafer is exposed through the opening. A top die is placed into the opening. The top die fits into the opening with substantially no gap between the patterned film and the top die. The top die is then bonded onto the bottom die, followed by curing the patterned film.
Claims27
A method of forming integrated circuits, the method comprising:
- laminating a patterned film comprising an opening onto a wafer, wherein a bottom die in the wafer is exposed through the opening;
- placing a top die into the opening, wherein the top die fits into the opening with substantially no gap between the patterned film and the top die;
- bonding the top die onto the bottom die;
- and
- curing the patterned film.
A method of forming integrated circuits, the method comprising:
- providing a wafer comprising a plurality of bottom dies;
- patterning a film to form a plurality of openings in the film, wherein the plurality of openings has positions aligned to positions of the plurality of bottom dies, and wherein each of the plurality of openings extends from one side to an opposite side of the film;
- and
- laminating the film onto the wafer, wherein each of the plurality of openings in the film is aligned to one of the plurality of bottom dies.
A method of forming integrated circuits, the method comprising:
- etching a top surface of a top wafer along scribe lines of the top wafer;
- polishing a back surface of the top wafer to separate the top wafer into a plurality of top dies;
- patterning a film to form a plurality of openings in the film, wherein the plurality of openings has positions corresponding to positions of a plurality of bottom dies in a bottom wafer;
- laminating the film onto the bottom wafer, wherein each of the plurality of openings in the film is aligned to one of the plurality of bottom dies;
- placing each of the plurality of top dies into one of the plurality of openings;
- after all of the plurality of top dies are placed in the plurality of openings, bonding the plurality of top dies onto the bottom wafer;
- and
- curing the film.
An integrated circuit structure comprising:
- a bottom die;
- a top die bonded onto the bottom die, wherein the top die has a slanted edge;
- and
- a filler material on the bottom die and encircling the top die.
Dependencies are inferred from the claim text.