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US 2010/0140766 A1Published application
Large die package structures and fabrication method therefor
AssigneeST Assembly Test Services Ltd.
InventorsJeffrey D. Punzalan, Jose Alvin Caparas, Jae Hun Ku
Life of this patent
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Abstract
A method for fabricating large die package structures is provided wherein at least portions of the leadtips of at least a plurality of leadfingers of a leadframe are electrically insulated. A die is positioned on the electrically insulated leadtips. The die is electrically connected to at least a plurality of the leadfingers.
Claims16
A method for fabricating large die package structures, comprising:
- providing a leadframe having a plurality of leadfingers;
- electrically insulating at least portions of the leadtips of at least a plurality of leadfingers of the leadframe;
- forming notches in at least a plurality of the leadtips;
- positioning a die in the notches on the electrically insulated leadtips;
- electrically connecting the die to at least some of the plurality of leadfingers;
- and
- encapsulating at least a portion of the leadframe and die in a mold compound.
4 more elements
A method for fabricating large die package structures, comprising:
- electrically insulating the leadtips of leadfingers of a leadframe;
- forming notches in the leadtips and configuring the notches for receiving a die therein;
- positioning a die in the notches on the electrically insulated leadtips;
- wire bonding the die to the leadfingers to electrically connect the die thereto;
- and
- encapsulating at least a portion of the leadframe and die in a mold compound.
3 more elements
A large die package structure, comprising:
- a leadframe having leadfingers;
- leadtips on the leadfingers;
- at least portions of the leadtips of at least some of the plurality of leadfingers being electrically insulated;
- notches in at least a plurality of the leadtips;
- a die positioned in the notches on the electrically insulated leadtips;
- the die being electrically connected to at least some of the plurality of leadfingers;
- and
- a mold compound encapsulating at least a portion of the leadframe and the die.
5 more elements
A large die package structure, comprising:
- a leadframe having leadfingers;
- leadtips on the leadfingers;
- the leadtips of the leadfingers being electrically insulated;
- notches in the leadtips configured for receiving a die in the notches;
- a die positioned in the notches on the electrically insulated leadtips;
- wirebonds electrically connecting the die to the leadfingers;
- and
- a mold compound encapsulating at least a portion of the leadframe and the die.
5 more elements
Dependencies are inferred from the claim text.