Wire-on-lead package system and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsZigmund Ramirez Camacho, Henry Descalzo Bathan, Jeffrey D. Punzalan, Lionel Chien Hui Tay
Life of this patent
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Abstract
A method of manufacture of a wire-on-lead package system includes: providing a die attach paddle with paddle extensions distributed along the periphery of the die attach paddle, providing leadfingers surrounding the die attach paddle, attaching a semiconductor die to the die attach paddle wherein the semiconductor die is larger than the die attach paddle, and connecting bond wires between the semiconductor die and the leadfingers and between the semiconductor die and the paddle extensions.
Claims20
A method of manufacture of a wire-on-lead package system comprising:
- providing a die attach paddle with paddle extensions distributed along the periphery of the die attach paddle;
- providing leadfingers surrounding the die attach paddle;
- attaching a semiconductor die to the die attach paddle wherein the semiconductor die is larger than the die attach paddle;
- and
- connecting bond wires between the semiconductor die and the leadfingers and between the semiconductor die and the paddle extensions.
A method of manufacture of a wire-on-lead package system comprising:
- providing a die attach paddle with paddle extensions distributed along the periphery of the die attach paddle;
- providing leadfingers surrounding the die attach paddle;
- attaching a semiconductor die to the die attach paddle wherein the semiconductor die is larger than the die attach paddle;
- connecting bond wires between the semiconductor die and the leadfingers and between the semiconductor die and the paddle extensions;
- and
- encapsulating portions of the semiconductor die, the leadfingers, the paddle extensions, and the bond wires using an encapsulant.
A wire-on-lead package system comprising:
- a die attach paddle with paddle extensions distributed along the periphery of the die attach paddle;
- leadfingers surrounding the die attach paddle;
- a semiconductor die attached to the die attach paddle wherein the semiconductor die is larger than the die attach paddle;
- and
- bond wires connecting the semiconductor die to the leadfingers and connecting the semiconductor die to the paddle extensions.
Dependencies are inferred from the claim text.