Semiconductor Device and Method of Forming a Shielding Layer over a Semiconductor Die after Forming a Build-Up Interconnect Structure

A method of making a semiconductor device, comprising:

• providing a substrate;
• forming a build-up interconnect structure over the substrate;
• mounting a semiconductor die to the build-up interconnect structure, the semiconductor die being electrically connected to the build-up interconnect structure;
• forming a shielding cage over the semiconductor die after forming the build-up interconnect structure to isolate the semiconductor die from inter-device interference, the shielding cage being electrically connected to a ground point;
• forming an encapsulant over the semiconductor die, shielding cage, and build-up interconnect structure;
• and
• removing the substrate.

A method of making a semiconductor device, comprising:

• providing a substrate;
• forming a build-up interconnect structure over the substrate;
• mounting a semiconductor die to the build-up interconnect structure;
• forming an encapsulant over the semiconductor die and build-up interconnect structure;
• forming a shielding layer over the semiconductor die after forming the build-up interconnect structure to isolate the semiconductor die from inter-device interference, the shielding layer being electrically connected to a ground point;
• and
• removing the substrate.

A semiconductor device, comprising:

• a build-up interconnect structure;
• a semiconductor die mounted to the build-up interconnect structure, the semiconductor die being electrically connected to the build-up interconnect structure;
• an encapsulant formed over the semiconductor die and build- up interconnect structure;
• and
• a shielding layer formed over the semiconductor die to isolate the semiconductor die from inter-device interference, the shielding layer being electrically connected to a ground point.