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US 2010/0140758 A1Published application
Integrated Circuit with Improved Transmission Line Structure and Electromagnetic Shielding Between Radio Frequency Circuit Paths
AssigneeSiGe Semiconductor Inc.
InventorsMark Doherty, Michael McPartlin, Chun-Wen Paul Huang
Life of this patent
Estimating the term…
Abstract
An integrated circuit is disclosed having through silicon vias spaced apart one from another and conductors, each coupled to one or more of the through silicon vias, the conductors in aggregate in use forming a segmented conductive plane maintained at a same potential and forming an electromagnetic shield.
Claims22
An apparatus comprising:
- an integrated circuit comprising:
- a plurality of through silicon vias;
- and,
- a plurality of conductors, each coupled to one or more of the plurality of through silicon vias, the conductors in aggregate forming a segmented conductive plane, the segmented conductive plane electrically coupled for being maintained at a same potential for forming an electromagnetic shield.
1 more element
An apparatus comprising:
- an integrated circuit comprising:
- a plurality of through silicon vias disposed within the integrated circuit and spaced apart with approximately uniform spacing for shielding of known wavelengths of electromagnetic radiation, the known wavelengths relating to the approximately uniform spacing;
- and,
- a plurality of conductors, each coupled to one or more of the plurality of through silicon vias, the conductors spaced apart with approximately uniform spacing for shielding of the known wavelengths of electromagnetic radiation and in aggregate forming a segmented conductive plane, the segmented conductive plane electrically coupled for being maintained at a same potential.
1 more element
An apparatus comprising:
- an integrated circuit comprising:
- a first RF signal conditioning circuit;
- a second RF signal conditioning circuit;
- a plurality of through substrate vias disposed within the integrated circuit between the first RF signal conditioning circuit and the second RF signal conditioning circuit and spaced apart with approximately uniform spacing for shielding of known wavelengths of electromagnetic radiation, the known wavelengths relating to the approximately uniform spacing, the plurality of through substrate vias coupled for being maintained at approximately a same potential;
- and,
- at least a conductor, coupled to at least one of the plurality of through substrate vias, the at least a conductor forming one of a conductive plane and a segmented conductive plane electrically coupled for being maintained at a same potential for forming an electromagnetic shield.
3 more elements
Dependencies are inferred from the claim text.