Semiconductor package having an antenna with reduced area and method for fabricating the same
AssigneeHynix Semiconductor Inc.
InventorTae Min KANG
Life of this patent
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Abstract
A semiconductor package includes an electromagnetic shielding member for shielding electromagnetic waves. An antenna is disposed on an upper face of the electromagnetic shielding member and includes an antenna part with a plurality of conductive particles electrically connected with each other and an insulation part disposed on the upper face of the electromagnetic shielding member and insulating the antenna part. Ball lands are disposed on the electromagnetic shielding member and are electrically connected with the antenna part. A Radio Frequency Identification (RFID) chip is electrically connected to the ball lands.
Claims20
A semiconductor package, comprising:
- an electromagnetic shielding member for shielding electromagnetic waves;
- an antenna disposed over an upper face of the electromagnetic shielding member, the antenna comprising:
- an antenna part having a plurality of conductive particles electrically connected with each other;
- and
- an insulation part surrounding the antenna part to insulate the antenna part;
- RFID chip ball lands disposed on the electromagnetic shielding member and electrically coupled to the antenna part;
- and
- a Radio Frequency Identification (RFID) chip electrically coupled to the RFID chip ball lands.
A method for fabricating a semiconductor package, comprising:
- preparing an electromagnetic shielding member for shielding electromagnetic waves;
- forming RFID chip ball lands on the electromagnetic shielding member;
- forming a preliminary antenna connecting the RFID chip ball lands on an upper face of the electromagnetic shielding member, wherein the preliminary antenna comprises conductive polarized particles respectively having different polarities and a flowable insulation material;
- applying power having different polarities to the respective RFID chip ball lands so as to electrically connect the conductive polarized particles within the flowable insulation material;
- curing the flowable insulation material;
- and
- electrically connecting terminals of an RFID chip to the respective RFID chip ball lands.
Dependencies are inferred from the claim text.