Stacked Semiconductor Component Having Through Wire Interconnect And Method Of Fabrication
AssigneeMicron Technology, Inc.
InventorDavid R. Hembree
Life of this patent
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Abstract
A stacked semiconductor component includes a plurality of semiconductor substrates in a stacked array and a continuous wire extending through aligned vias on the semiconductor substrates of the stacked array in electrical contact with contacts on the semiconductor substrates. A method for fabricating the semiconductor component includes the steps of stacking the semiconductor substrates in a stacked array with aligned vias; threading a wire through the aligned vias; and forming a plurality of electrical connections between the wire and the contacts on the semiconductor substrates.
Claims27
A semiconductor component comprising:
- a plurality of semiconductor substrates in a stacked array, each semiconductor substrate comprising a first side, a second side, at least one integrated circuit, a contact on the first side in electrical communication with the integrated circuit, and an electrically insulated via from the first side to the second side;
- and
- a continuous wire having an outside diameter less than an inside diameter of the via extending through aligned vias on the semiconductor substrates of the stacked array and in electrical contact with at least one contact on a semiconductor substrate.
A semiconductor component comprising:
- a plurality of semiconductor substrates in a stacked array, each semiconductor substrate comprising a first side, a second side, at least one integrated circuit, a contact on the first side in electrical communication with the integrated circuit, and an electrically insulated via from the first side to the second side;
- and
- a through wire interconnect comprising a continuous wire through aligned vias on the semiconductor substrates of the stacked array having a bonded contact with a first semiconductor substrate of the stacked array, a plurality of bonded connections with contacts on the semiconductor substrates, and a contact ball on a second semiconductor substrate of the stacked array.
A method for fabricating a semiconductor component comprising:
- providing a plurality of semiconductor substrates, each semiconductor substrate comprising a first side, a second side, at least one integrated circuit, a contact on the first side in electrical communication with the integrated circuit, and an electrically insulated via from the first side to the second side;
- stacking the semiconductor substrates in a stacked array with aligned vias;
- threading a wire through the aligned vias;
- and
- forming at least one electrical connection between the wire and at least one contact on at least one semiconductor substrate.
Dependencies are inferred from the claim text.