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US 2010/0140748 A1Published application
Integrated circuits on a wafer and methods for manufacturing integrated circuits
AssigneeNXP B.V.
InventorHeimo Scheucher
Life of this patent
Estimating the term…
Abstract
Integrated circuits (1) on a wafer comprise a wafer substrate (2) and a plurality of integrated circuits (1a, 1b, 1c) formed on the wafer substrate (2). Each integrated circuit (1a, 1b, 1c) comprises an electric circuit (24) and some of the integrated circuits (1b, 1c) comprise, in addition to their electric circuits (24), process control modules (3) as integral parts. The process control modules (3) are employed during dicing and pick-and-place to align the dicing/pick-and-place devices.
Claims14
Integrated circuits on a wafer, comprising
- a wafer substrate (2);
- and
- a plurality of integrated circuits (1a, 1b, 1c) formed on the wafer substrate (2);
- wherein each integrated circuit (1a, 1b, 1c) comprises an electric circuit (24) and some of the integrated circuits (1b, 1c) comprise, in addition to their electric circuits (24), a process control modules (3) as integral parts.
1 more element
Dependencies are inferred from the claim text.