Methods of depositing electrically active doped crystalline si-containing films
AssigneeASM America, Inc.
InventorMATTHIAS BAUER
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Abstract
Methods of making Si-containing films that contain relatively high levels of Group III or Group V dopants involve chemical vapor deposition using trisilane and a dopant precursor. Extremely high levels of substitutional incorporation may be obtained, including crystalline silicon films that contain at least about 3×1020 atoms cm−3 of an electrically active dopant. Substitutionally doped Si-containing films may be selectively deposited onto the crystalline surfaces of mixed substrates by introducing an etchant gas during deposition.
Claims14
An as-deposited doped single crystalline Si-containing film comprising at least about 3×1020 atoms cm−3 of an n-dopant and having a resistivity of 0.7 mΩ·cm or less.
A single crystalline Si-containing film comprising at least about 3×1020 atoms cm−3 of an n-dopant, and less than about 3×1019 atoms cm−3 of electrically inactive atoms of the n-dopant and having a resistivity of 0.7 mΩ·cm or less.
Dependencies are inferred from the claim text.