Back-side illuminated image sensor
AssigneeSamsung Electronics Co., Ltd.
InventorsYong Jei Lee, Jung Chak Ahn, Jong Eun Park, Dong-Yoon Jang
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Abstract
In an example embodiment, the backside-illuminated image sensor includes a substrate including a plurality of photoelectric conversion devices being separated by a semiconductor. The backside-illuminated sensor further includes a transparent electrode layer or a metal layer formed on a surface of a substrate. As a positive bias voltage or a negative bias voltage is applied to the transparent electrode layer or the metal layer, generation of dark current in the surface of the silicon substrate may be reduced or suppressed.
Claims14
A back-side illuminated image sensor comprising:
- a substrate including a plurality of photoelectric conversion devices, the photoelectric conversion devices being separated by a semiconductor material;
- and
- a transparent electrode layer formed on the substrate and one of a positive bias voltage and a negative bias voltage is applied.
A back-side illuminated image sensor comprising:
- a substrate including a plurality of photoelectric conversion devices, the photoelectric conversion devices being separated by a semiconductor material;
- an insulation layer formed on the substrate;
- and
- a plurality of metal layers formed in at least one of an upper and a lower portion of the insulation layer and being separated from each other.
Dependencies are inferred from the claim text.