Printing shielded connections and circuits
AssigneePalo Alto Research Center Incorporated
InventorsJurgen H. Daniel, Tse Nga Ng
Life of this patent
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AssigneePalo Alto Research Center Incorporated
InventorsJurgen H. Daniel, Tse Nga Ng
Estimating the term…
An embodiment is a method and apparatus to construct a shielded cable, wire, or circuit. A first insulator layer is deposited on a first conductor or semiconductor layer. A second conductor or semiconductor layer is deposited on the first insulator layer. A second insulator layer is deposited on the first insulator layer. The second insulator layer covers the second conductor or semiconductor layer and defines a shielded region. A third conductor or semiconductor layer is deposited on the first conductor or semiconductor layer. The third conductor or semiconductor layer covers the first and second insulator layers. At least one of the first, second, and third conductor or semiconductor layers, and the first and second insulator layers is deposited by printing.
An apparatus comprising:
The apparatus of claim 7 wherein the printed conductor is made of one of polyacetylene, polyaniline, a polymer mixture of two ionomers, sintered metal nanoparticles, a metal precursor, carbon nanotubes, metal nanowires, and a printed seed material for plating.
The apparatus of claim 10 wherein the active component is an electrical component or an optical component.
A method comprising:
A circuit comprising:
Dependencies are inferred from the claim text.