Light emitting element module and method for sealing light emitting element
AssigneeSony Chemical & Information Device Corporation
InventorsKouki Hatsuda, Hiroshi Samukawa
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AssigneeSony Chemical & Information Device Corporation
InventorsKouki Hatsuda, Hiroshi Samukawa
Estimating the term…
Disclosed is a method for sealing a light-emitting device wherein formation of air bubbles in a light-emitting device module can be prevented by performing no gelation after fitting of a cover member. This method also enables to seal a light-emitting device by using a gel sealing material composed of a gel precursor which uses a solvent. Also disclosed is a light-emitting module formed by such a sealing method. In this method for sealing a light-emitting device, gelation of the gel precursor of a gel sealing material is performed before placing the precursor on the light-emitting device, and thus no gelation is necessary after fitting of a cover member. Consequently, a gel precursor having high viscosity that is difficult to be used in an injection method can be used in this method. Furthermore, a substance which requires use of a solvent can be used as a gel precursor of a gel sealing material. A light-emitting device module with high luminance wherein no air bubbles are included can be obtained by this method.
A method for sealing a light emitting element with a gel sealant made by causing a gel precursor to gel to lose fluidity, comprising the steps of:
A light emitting element module, comprising:
Dependencies are inferred from the claim text.