Optical semiconductor device and method of manufacturing optical semiconductor device

A method of manufacturing an optical semiconductor device comprising the steps of:

• dividing a light emitting element wafer on a support body into light emitting elements by cutting the light emitting element wafer in a direction toward the support body;
• rearranging the light emitting elements by expanding the support body;
• forming a first conductive member on a first electrode provided on a first surface of each of the light emitting elements;
• sealing the light emitting elements and the first conductive members by an enclosure;
• detaching the support body and forming a second conductive member on a second electrode provided on a second surface of each of the light emitting elements;
• sealing the second electrodes and the second conductive members by the enclosure;
• connecting a first external electrode to the first conductive member and connecting a second external electrode to the second conductive member;
• performing dicing between each adjacent two of the light emitting elements to divide optical semiconductor devices from each other;
• and
• forming plating films respectively on the first external electrode and the second external electrode by plating.

A method of manufacturing an optical semiconductor device comprising the steps of:

• dividing a light emitting element wafer on a support body into light emitting elements by cutting the light emitting element wafer in a direction toward the support body;
• rearranging the light emitting elements by expanding the support body;
• forming a first conductive member on a first electrode provided on a first surface of each of the light emitting elements;
• sealing the light emitting elements and the first conductive members by an enclosure;
• detaching the support body and forming a second conductive member on a second electrode provided on a second surface of each of the light emitting elements;
• sealing the second electrodes and the second conductive members by the enclosure;
• grinding the first conductive member and the enclosure sealing the first conductive member so that the first conductive member and the enclosure are oblique with respect to the first surface;
• forming on the ground surface a first external electrode to be connected to the first conductive member;
• grinding the second conductive member and the enclosure sealing the second conductive member so that the second conductive member and the enclosure are oblique with respect to the second surface;
• forming on the ground surface a second external electrode to be connected to the second conductive member;
• performing dicing between each adjacent two of the light emitting elements to divide optical semiconductor devices from each other;
• and
• forming plating films respectively on the first external electrode and the second external electrode by plating.