Filmy adhesive for circuit connection
AssigneeHitachi Chemical Company, Ltd.
InventorsKazuyoshi Kojima, Kouji Kobayashi, Motohiro Arifuku
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Abstract
A filmy adhesive for circuit connection that is interposed between circuit electrodes opposed to each other and by heating and applying pressure to the circuit electrodes opposed to each other, attains electrical connection between the electrodes along the direction of pressure application, characterized in that the angle of contact of the adhesive after hardening with water is 90° or greater.
Claims15
A film-like adhesive for circuit connection which is situated between mutually opposing circuit electrodes and, upon heating and pressing the mutually opposing circuit electrodes, electrically connects the electrodes in the pressing direction, said film-like adhesive for circuit connection having a water contact angle after curing of 90° or greater.
A film-like adhesive for circuit connection which is situated between mutually opposing circuit electrodes and, upon heating and pressing the mutually opposing circuit electrodes, electrically connects the electrodes in the pressing direction, the film-like adhesive for circuit connection comprising a phenoxy resin having an aromatic cyclic structure containing two or more benzene rings, an epoxy resin, a rubber component and a latent curing agent.
Dependencies are inferred from the claim text.