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US 2010/0140534 A1Published application
EMI/RFI Shielding Resin Composite Material and Molded Product Made Using the Same
AssigneeCheil Industries Inc.
InventorsSung-Jun Kim, Chang-Min Hong
Life of this patent
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Abstract
Disclosed is an electromagnetic wave EMI/RFI shielding resin composite material that includes a thermoplastic polymer resin, an electrically conductive filler having a polyhedral shape or being capable of forming a polyhedral shape, and a low-melting point metal, and a molded product made using the EMI/RFI shielding resin composite material.
Claims13
An electromagnetic wave interference (EMI)/radio frequency interference (RFI) shielding resin composite material, comprising:
- (A) a thermoplastic polymer resin;
- (B) an electrically conductive filler having a polyhedral shape or being capable of forming a polyhedral shape;
- and
- (C) a low-melting point metal.
1 more element
Dependencies are inferred from the claim text.