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US 2010/0140327 A1Published application
Spot Heat Wirebonding
AssigneeTexas Instruments Incorporated
InventorsNorihiro KAWAKAMI, Yoshikatsu UMEDA, Sohichi KADOGUCHI
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Abstract
Methods and systems are disclosed for forming secure wirebonds between electrical contacts in electronic device assemblies. Representative embodiments of the invention are described for forming a wirebond including system components and method steps for generating electromagnetic energy from a heat source and transmitting heat to a ball formed on a bondwire. Subsequently, pressure applied to the ball at the bonding site is used in the formation of a wirebond.
Claims8
A method of wirebonding for use in assembling electronic devices comprising the steps of:
- positioning a ball at an end of a bondwire adjacent to but not in contact with a bonding site with a bonding tool;
- transmitting electromagnetic energy for heating the bondwire, ball, and bonding tool;
- and
- placing the heated ball in contact with the bonding site using the bonding tool, forming a ballbond on the bonding site.
1 more element
Dependencies are inferred from the claim text.