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US 2010/0140222 A1Published application
Filled polymer composition for etch chamber component
OwnerJennifer Y. Sun, Ren-Guan Duan +2inventors
InventorsJennifer Y. Sun, Ren-Guan Duan, Senh Thach, Li Xu
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Abstract
A filled polymer composition having improved plasma resistance is disclosed. The composition includes a particle filler dispersed in a polymer matrix. The particle filler can be Nb2O5, YF3, AlN, SiC or Si3N4 and rare earth oxides. In an embodiment, the composition is utilized as a bonding adhesive for electrostatic chuck, bonding adhesive for shower head, bonding adhesive for liner, sealing material, O-ring, or plastic component.
Claims20
A composition comprising:
- a polymer matrix;
- a particle filler dispersed in the polymer matrix;
- wherein the particle filler is selected from the group consisting of Nb2O5, YF3, MN, Al, SiC, Si3N4, rare earth oxides, and combinations thereof.
A method of operating an etch chamber comprising:
- striking a plasma;
- and
- exposing a chamber component to the plasma;
- wherein the chamber component comprises a polymer matrix and a particle filler dispersed in the polymer matrix, the particle filler selected from the group consisting of Nb2O5, YF3, AN, Al, SiC, Si3N4, rare earth oxides, and combinations thereof.
1 more element
An etch chamber comprising:
- a shower head;
- an electrostatic chuck;
- a cathode;
- a liner;
- and
- a chamber component comprising a polymer matrix and a particle filler dispersed in the polymer matrix, the particle filler selected from the group consisting of Nb2O5, YF3, AN, Al, SiC, Si3N4, rare earth oxides, and combinations thereof.
3 more elements
Dependencies are inferred from the claim text.