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US 2010/0140100 A1Published application
Manufacturing method of printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsWoon-Chun KIM, Soon-Gyu Yim, Young-Ju Kim, Hwa-Jan Jung
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Abstract
Disclosed is a method of manufacturing a printed circuit board. The method can include providing a carrier formed with a release layer, performing a roughening treatment on the release layer such that the release layer has surface roughness, forming a circuit pattern on the release layer, stacking the carrier on an insulating layer such that the circuit pattern is buried in the insulating layer, and separating the release layer and the carrier from the insulating layer and the circuit pattern.
Claims4
A method of manufacturing a printed circuit board, the method comprising:
- providing a carrier formed with a release layer;
- performing a roughening treatment on the release layer such that the release layer has surface roughness;
- forming a circuit pattern on the release layer;
- stacking a carrier on an insulating layer such that the circuit pattern is buried in the insulating layer;
- and
- separating the release layer and the carrier from the insulating layer and the circuit pattern.
3 more elements
Dependencies are inferred from the claim text.