Dual Magnetron Sputtering Power Supply And Magnetron Sputtering Apparatus

A dual magnetron sputtering power supply for use with a magnetron sputtering apparatus having at least first and second sputtering cathodes (1, 4) for operation in a dual magnetron sputtering mode, there being an AC power supply (8) connected to the first and second sputtering cathodes (1, 4), a means (9, 10) for supplying a flow of reactive gas to each of said first and second cathodes (1, 4) via first and second flow control valves (12, 14) each associated with a respective one of said first and second cathodes (1, 4) and each adapted to control a flow of reactive gas to the respectively associated cathode, the power supply having, for each of said first and second cathodes, a means for deriving a feedback signal (V1, V4) relating to the voltage prevailing at that cathode (1, 4), a control circuit (18, 20) for controlling the flow of reactive gas to the respectively associated cathode (1, 4) by controlling the respective flow control valve (12, 14) and adapted to adjust the respective flow control valve (12, 14) to obtain a voltage feedback signal (V1, V4) from the respective cathode (1, 4) corresponding to a set point value (V1 SET POINT, V4 SET POINT) set for that cathode, wherein said control circuit (18, 20) comprises a respective regulator for each cathode having as inputs the feedback signals (V1, V4) from the cathodes (1, 4) and respective set point signals (V1 SET POINT, V4 SET POINT) and producing as outputs a respective partial pressure set point signal (P1 DES. and (P4 DES.), wherein a respective probe (λ1, λ4) respectively associated with each cathode (1, 4) generates an actual pressure signal of the reactive gas (P1ACT, P4ACT), wherein the partial pressure set point signals (P1 DES., P4 DES.) and the respective actual pressure signals (P1ACT, P4ACT) are applied to respective inputs of further regulators (30, 32), the respective output signals of which serve to generate actuation signals (P1OUT and P4OUT) for actuating the flow control valves (12, 14) supplying reactive gas to the respectively associated cathodes (1, 4).

A magnetron sputtering apparatus in combination with or having a dual magnetron sputtering power having at least first and second sputtering cathodes (1, 4) for operation in a dual magnetron sputtering mode, there being an AC power supply (8) connected to the first and second sputtering cathodes (1, 4), a means (9, 10) for supplying a flow of reactive gas to each of said first and second cathodes (1, 4) via first and second flow control valves (12, 14) each associated with a respective one of said first and second cathodes (1, 4) and each adapted to control a flow of reactive gas to the respectively associated cathode, the power supply having, for each of said first and second cathodes, a means for deriving a feedback signal (V1, V4) relating to the voltage prevailing at that cathode (1, 4), a control circuit (18, 20) for controlling the flow of reactive gas to the respectively associated cathode (1, 4) by controlling the respective flow control valve (12, 14) and adapted to adjust the respective flow control valve (12, 14) to obtain a voltage feedback signal (V1, V4) from the respective cathode (1, 4) corresponding to a set point value (V1 SET POINT, V4 SET POINT) set for that cathode, wherein said control circuit (18, 20) comprises a respective regulator for each cathode having as inputs the feedback signals (V1, V4) from the cathodes (1, 4) and respective set point signals (V1 SET POINT, V4 SET POINT) and producing as outputs a respective partial pressure set point signal (P1 DES. and P4 DES.), wherein a respective probe (λ1, λ4) respectively associated with each cathode (1, 4) generates an actual pressure signal of the reactive gas (P1ACT, P4ACT), wherein the partial pressure set point signals (P1 DES., P4 DES.) and the respective actual pressure signals (P1ACT, P4ACT) are applied to respective inputs of further regulators (30, 32), the respective output signals of which serve to generate actuation signals (P1OUT and P4OUT) for actuating the flow control valves (12, 14) supplying reactive gas to the respectively associated cathodes (1, 4).