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US 2010/0139971 A1Published application
Electromagnetic wave suppression sheet, device, and electronic apparatus
AssigneeSony Corporation
InventorsYoshihiro Kato, Yoshito Ikeda
Life of this patent
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Abstract
Disclosed is an electromagnetic wave suppression sheet obtained by mixing metallic magnetic particles into a resin and formed into a sheet shape. In the electromagnetic wave suppression sheet, a coercive force is 320 [A/m] or more and a saturation magnetization is 0.35 [Wb/m2] or more at a time when an external magnetic field of 1 kOe in an in-plane direction is applied.
Claims9
An electromagnetic wave suppression sheet obtained by mixing metallic magnetic particles into a resin and formed into a sheet shape,
- wherein a coercive force is 320 [A/m] or more and a saturation magnetization is 0.35 [Wb/m2] or more at a time when an external magnetic field of 1 kOe in an in-plane direction is applied.
A device, comprising:
- a package of an integrated circuit element;
- and
- an electromagnetic wave suppression sheet obtained by mixing metallic magnetic particles into a resin and formed into a sheet shape, in which a coercive force is 320 [A/m] or more and a saturation magnetization is 0.35 [Wb/m2] or more at a time when an external magnetic field of 1 kOe in an in-plane direction is applied, the electromagnetic wave suppression sheet being bonded to the package of the integrated circuit element.
An electronic apparatus, comprising:
- an integrated circuit element;
- a wiring;
- and
- an electromagnetic wave suppression sheet obtained by mixing metallic magnetic particles into a resin and formed into a sheet shape, in which a coercive force is 320 [A/m] or more and a saturation magnetization is 0.35 [Wb/m2] or more at a time when an external magnetic field of 1 kOe in an in-plane direction is applied, the electromagnetic wave suppression sheet being disposed in a vicinity of one of the integrated circuit element and the wiring.
1 more element
Dependencies are inferred from the claim text.