Wiring board having lead pin, and lead pin
AssigneeShinko Electric Industries Co., Ltd.
InventorsKazuhiro Oshima, Yoshikazu Hirabayashi, Shigeo Nakajima, Yoshitaka Matsushita
Life of this patent
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Abstract
A wiring board having a lead pin is provided. The wiring board having the lead pin includes a connecting pad which is formed on the wiring board, and to which the lead pin is bonded through a conductive material. The lead pin includes: a shaft portion; a head portion which is provided on one end of the shaft portion; a protruded portion which is formed on a surface side of the head portion opposed to the connection pad; and a first taper portion which is formed between the head portion and a base part of the shaft portion.
Claims20
A wiring board having a lead pin comprising:
- a connecting pad which is formed on the wiring board, and to which the lead pin is bonded through a conductive material,
- wherein the lead pin includes:
- a shaft portion;
- a head portion which is provided on one end of the shaft portion;
- a protruded portion which is formed on a surface side of the head portion opposed to the connection pad;
- and
- a first taper portion which is formed between the head portion and a base part of the shaft portion.
A lead pin bonded through a conductive material to a connecting pad formed on a wiring board, comprising:
- a shaft portion;
- a head portion which is provided on one end of the shaft portion;
- a protruded portion which is formed on a surface side of the head portion opposed to the connection pad;
- and
- a first taper portion which is formed between the head portion and a base part of the shaft portion.
Dependencies are inferred from the claim text.