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US 2010/0139969 A1Published application
Printed circuit board comprising metal bump and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJin Yong An, Ki Hwan Kim
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Abstract
Disclosed herein is a printed circuit board, including: metal bumps having constant diameters and protruding over an insulation layer; a circuit layer formed beneath the insulation layer; and vias passing through the insulation layer to connect the metal bumps with the circuit layer.
Claims10
A printed circuit board, comprising:
- metal bumps having constant diameters and protruding over an insulation layer;
- a circuit layer formed beneath the insulation layer;
- and
- vias passing through the insulation layer to connect the metal bumps with the circuit layer.
1 more element
A method of manufacturing a printed circuit board, comprising:
- providing a metal layer;
- forming an insulation layer on the metal layer and then forming via holes for exposing the metal layer in the insulation layer;
- forming vias charged in the via holes and a circuit layer on the insulation layer;
- and
- forming metal bumps at ends of the vias.
2 more elements
Dependencies are inferred from the claim text.