Wiring board and fabrication method therefor
AssigneeIbiden Co., Ltd.
InventorMichimasa Takahashi
Life of this patent
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Abstract
A wiring board includes an insulating board, wiring sub boards, and insulating layers having via holes in which conductors are formed by plating. The insulating board and the wiring sub boards are horizontally laid out. The insulating layers are laid out to respectively cover a first boundary portion between the insulating board and each of the wiring sub boards, and a second boundary portion between the wiring sub boards, and continuously extend from the insulating board to wiring sub boards. Resins which constitute the insulating layers are filled in the first boundary portion and the second boundary portion. The conductors are electrically connected to the wiring layers.
Claims15
A wiring board comprising:
- a plurality of wiring sub boards being laid out side by side with each other and having conductive patterns;
- an insulating board being laid out alongside of one of the plurality of wiring sub boards;
- and
- a plurality of insulating layers comprising an insulating material and having via holes in which conductors electrically connected to the conductive patterns are formed by plating, the insulating layers continuously extending from the insulating board to the wiring sub boards so as to respectively cover a first boundary portion between the insulating board and each of the wiring sub boards, and a second boundary portion between the wiring sub boards,
- wherein the first boundary portion and the second boundary portion are filled with the insulating material of the insulating layers.
A method for fabricating a wiring board, comprising:
- horizontally laying an insulating board and a plurality of wiring sub boards having conductive patterns;
- laying insulating layers to respectively cover a first boundary portion between the insulating board and each of the wiring sub boards, and a second boundary portion between the wiring sub boards;
- filling an insulating material for the insulating layers in the first boundary portion and the second boundary portion;
- forming via holes in the insulating layers and forming conductors in the via holes by plating;
- and
- electrically connecting the conductors formed in the via holes to the conductive patterns.
Dependencies are inferred from the claim text.