Inner substrate for manufacturing multilayer printed circuit boards
AssigneeFoxconn Advanced Technology Inc.
InventorsCHIH-KANG YANG, CHENG-HSIEN LIN
Life of this patent
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Abstract
An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line of weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other.
Claims13
An inner substrate for manufacturing multilayer printed circuit boards, the inner substrate comprising:
- a plurality of substrate units and a plurality of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate, each of the substrate units being configured for forming a unitary multilayer printed circuit board, each of the folding portions being interconnected between two neighboring substrate units, each of the folding portions defining at least one line of weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the inner substrate.
Dependencies are inferred from the claim text.