Embedded circuit substrate and manufacturing method thereof
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChien-Hao Wang, Ming-Chiang Lee
Life of this patent
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Abstract
An embedded circuit substrate comprising: a core structure having a first surface and a second surface opposite to each other; a first patterned conductive layer disposed on the first surface and embedded in the core structure; a second patterned conductive layer disposed on the second surface and embedded in the core structure; and a plurality of conductive blocks disposed in the core structure for conducting the first patterned conductive layer and the second patterned conductive layer is provided. Furthermore, a manufacturing method of an embedded circuit substrate is also provided.
Claims20
An embedded circuit substrate, comprising:
- a core structure, having a first surface and a second surface opposite to each other;
- a first patterned conductive layer, disposed on the first surface and embedded in the core structure;
- a second patterned conductive layer, disposed on the second surface and embedded in the core structure;
- and
- a plurality of conductive blocks, disposed in the core structure for conducting the first patterned conductive layer and the second patterned conductive layer.
A manufacturing method of embedded circuit substrate, comprising:
- providing a core structure having a first surface and a second opposite to each other;
- and
- providing a first conductive laminated structure, wherein the first conductive laminated structure comprises:
- a first metal layer;
- and
- a first patterned conductive layer, disposed on the first metal layer;
- and
- providing a second conductive laminated structure, wherein the second conductive laminated structure comprises:
- a second metal layer;
- and
- a second patterned conductive layer, disposed on the second metal layer;
- laminating the first conductive laminated structure and the second conductive laminated structure to the core structure, wherein the first patterned conductive layer is embedded in the first surface of the core structure, and the second patterned conductive layer is embedded in the second surface of the core structure;
- forming a plurality of first conductive blocks in the core structure, wherein the first patterned conductive layer and the second patterned conductive layer are conducted via the first conductive blocks;
- and
- removing the first metal layer and the second metal layer.
Dependencies are inferred from the claim text.