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US 2010/0139964 A1Published application
Printed circuit board comprising metal bump and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJin Yong An, Jae Joon Lee
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Abstract
Disclosed herein is a printed circuit board, including: an upper circuit layer including connection pads made of a conductive metal and buried in an insulation layer; and metal bumps, each having a constant diameter, which are integrated with the connection pads and protrude over the insulation layer.
Claims11
A printed circuit board, comprising:
- an upper circuit layer including connection pads made of a conductive metal and buried in an insulation layer;
- and
- metal bumps, each having a constant diameter, which are integrated with the connection pads and protrude over the insulation layer.
A method of manufacturing a printed circuit board, comprising:
- applying a dry film on a carrier and then patterning the dry film to form holes for forming metal bumps;
- forming an upper circuit layer including metal bumps charged in the holes and connection pads on the dry film;
- forming an insulation layer on the dry film;
- forming a build-up layer including a lower circuit layer on the insulation layer;
- removing the carrier;
- and
- removing the dry film.
4 more elements
Dependencies are inferred from the claim text.