Heat dissipation device
AssigneesFu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorsZHI-SHENG LIAN, GEN-PING DENG, CHUN-CHI CHEN
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AssigneesFu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorsZHI-SHENG LIAN, GEN-PING DENG, CHUN-CHI CHEN
Estimating the term…
A heat dissipation device includes a base, first and second fin units, two heat pipes, and a fan. The first fin unit is located on the base, and the second fin unit is located on the first fin unit. Each fin unit comprises a plurality of parallel fins with a plurality of channels defined therebetween. Each fin comprises an inlet section, an outlet section and a neck section interconnecting the inlet and outlet sections. A height of the neck section reduces gradually from the inlet section to the outlet section. Each heat pipe comprises an evaporating portion connecting with the base and a condensing portion inserting into a corresponding one of the outlet sections of the first and second fin units. The fan is located above the base and mounted onto the inlet sections of the first and second fin units.
A heat dissipation device comprising:
A heat dissipation device comprising:
A heat dissipation device comprising:
Dependencies are inferred from the claim text.