Analysis apparatus
AssigneeFujitsu Limited
InventorsHideharu Matsushita, Akira Ueda
Life of this patent
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Abstract
An analysis apparatus for a printed circuit board includes a converting portion that rewrites physical property data of a wiring layer in contact with a mounting surface having the part corresponding to an extracted electronic part data to a value based on the physical property data of an electronic part, and converts the physical property data of a region having the electronic part corresponding to the electronic part data extracted by the extracting portion to the physical property data of an insulating layer.
Claims6
An analysis apparatus for a printed circuit board comprising:
- an acquiring portion that acquires printed circuit board model data on a printed circuit board having electronic parts in an external wiring layer and an internal wiring layer and having an insulating layer between the wiring layers;
- an extracting portion that extracts, from the printed circuit board model data, electronic part data corresponding to an electronic part mounted in the internal wiring layer and having a heat-generating attribute among the electronic parts;
- a converting portion that rewrites physical property data of the wiring layer in contact with a mounting surface having the part corresponding to the extracted electronic part data to a value based on the physical property data of the electronic part and converts the physical property data of a region having the electronic part corresponding to the electronic part data extracted by the extracting portion to the physical property data of the insulating layer;
- and
- an analysis portion that uses the printed circuit board model data converted by the converting portion to perform thermal analysis processing.
An analysis method for a printed circuit board comprising:
- acquiring printed circuit board model data on a printed circuit board having electronic parts in an external wiring layer and an internal wiring layer and having an insulating layer between the wiring layers;
- extracting, from the printed circuit board model data, the electronic part data corresponding to an electronic part mounted in the internal wiring layer and having a heat-generating attribute among the electronic parts;
- rewriting physical property data of the wiring layer in contact with the mounting surface having the part corresponding to the extracted electronic part data to a value based on the physical property data of the electronic part, and converting the physical property data of a region having the electronic part corresponding to the electronic part data extracted by the extracting portion to the physical property data of the insulating layer;
- and
- performing thermal analysis using the converted printed circuit board model data.
A computer-readable recording medium encoded with a computer program that causes a computer to execute processing for an analysis of a printed circuit board, the medium comprising:
- acquiring printed circuit board model data on a printed circuit board having electronic parts in an external wiring layer and an internal wiring layer and having an insulating layer between the wiring layers;
- extracting, from the printed circuit board model data, the electronic part data corresponding to an electronic part mounted in the internal wiring layer and having a heat-generating attribute among the electronic parts;
- rewriting physical property data of the wiring layer in contact with the mounting surface having the part corresponding to the extracted electronic part data to a value based on the physical property data of the electronic part, and converting the physical property data of a region having the electronic part corresponding to the electronic part data extracted by the extracting portion to the physical property data of the insulating layer;
- and
- performing thermal analysis using the converted printed circuit board model data.
Dependencies are inferred from the claim text.