# US 2010/0136799 A1 · Method of manufacturing semiconductor device, Exposure device, and recording medium

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- Number: US 2010/0136799 A1
- Document ID: US20100136799A1
- Status: Published application
- Kind: A1
- Application number: 12/591,597
- Filed: 2009-11-24
- Published: 2010-06-03
- Earliest claimed: 2008-11-28
- Assignees: NEC Electronics Corporation
- Inventors: Toshiaki Koshitaka
- Web page: https://patentgrep.com/patent/US20100136799A1

## CPC

- G03F 7/70875: {Temperature, e.g. temperature control of masks or workpieces via control of stage temperature}
- G03F 7/707: {Chucks, e.g. chucking or un-chucking operations or structural details}
- G03F 7/70733: {Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask}
- G03F 7/70783: {Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight}
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)

## Abstract

A method of manufacturing a semiconductor device includes a first absorption step, a releasing step, a second absorption step, and an exposure step. In the first absorption step, a wafer chuck of a wafer stage absorbs the semiconductor wafer to adjust the temperature of the semiconductor wafer. In the releasing step, the semiconductor wafer is released from the wafer chuck. In the second absorption step, a wafer chuck of a wafer stage for exposure absorbs the semiconductor wafer. In the exposure step, the semiconductor wafer is exposed.

## Claims

### Claim 1

A method of manufacturing a semiconductor device, comprising:
allowing a wafer chuck of a first wafer stage to absorb a semiconductor wafer to adjust the temperature of said semiconductor wafer;
releasing said semiconductor wafer from said wafer chuck;
allowing a wafer chuck of a wafer stage for exposure to absorb said semiconductor wafer; and
exposing said semiconductor wafer.

### Claim 2 (depends on 1)

The method of manufacturing a semiconductor device as set forth in claim 1,
wherein said wafer stage for exposure is said first wafer stage.

### Claim 3 (depends on 2)

The method of manufacturing a semiconductor device as set forth in claim 2,
wherein a plurality of first wafer stages is provided, and
while one of said first wafer stages is used to perform said step of exposing said semiconductor wafer, another first wafer stage is used to perform at least one of said step of allowing said wafer chuck of said first wafer stage to absorb said semiconductor wafer to adjust. the temperature of said semiconductor wafer, said step of releasing said semiconductor wafer from said wafer chuck and said step of allowing said wafer chuck of said wafer stage for expose to absorb said semiconductor wafer.

### Claim 4 (depends on 1)

The method of manufacturing a semiconductor device as set forth in claim 1,
wherein said wafer stage for exposure is a second wafer stage different from said first wafer stage.

### Claim 5

An exposure device comprising:
a wafer chuck that absorbs a semiconductor wafer; and
a control unit that controls said wafer chuck,
wherein, before an exposure process, said control unit performs a first absorption process of allowing said wafer chuck to absorb said semiconductor wafer to adjust the temperature of said semiconductor wafer, a releasing process of allowing said wafer chuck to release said semiconductor, and a second absorption process of allowing said wafer chuck to reabsorb said semiconductor wafer.

### Claim 6 (depends on 5)

The exposure device as set forth in claim 5,
wherein a plurality of wafer chucks is provided, and
while one of said wafer chucks is used to perform said exposure process, said control unit performs at least one of said first absorption process, said releasing process, and said second absorption process using another wafer chuck.

### Claim 7

An exposure device comprising:
a first wafer stage including a first wafer chuck that absorbs a semiconductor wafer;
a second wafer stage for exposure including a second wafer chuck which absorbs said semiconductor wafer;
a wafer moving mechanism that moves said semiconductor wafer; and
a control unit that controls said wafer moving mechanism, said first wafer chuck, and said second wafer chuck,
wherein said control unit performs a process of allowing said first wafer chuck of said first wafer stage to absorb said semiconductor wafer to adjust the temperature of said semiconductor wafer, a process of allowing said first wafer chuck to release said semiconductor wafer, a process of allowing said wafer moving mechanism to move said semiconductor wafer over said first wafer stage to said second wafer stage, and a process of allowing said second wafer chuck of said second wafer stage to absorb said semiconductor wafer.

### Claim 8

A recording medium comprising a program stored therein that is installed in a control unit of an exposure device including a wafer chuck which absorbs a semiconductor wafer and said control unit which controls said wafer chuck, said program causes said control unit to perform, before an exposure process:
a first absorption process of allowing said wafer chuck to absorb said semiconductor wafer to adjust the temperature of said semiconductor wafer;
a releasing process of allowing said wafer chuck to release said semiconductor wafer; and
a second absorption process of allowing said wafer chuck to reabsorb said semiconductor wafer.

### Claim 9 (depends on 8)

The recording medium as set forth in claim 8,
wherein said exposure device includes a plurality of said wafer chucks, and
while one of said wafer chucks is used to perform said exposure process, said program causes said control unit to perform at least one of said first absorption process, said releasing process, and said second absorption process using another wafer chuck.

### Claim 10

A recording medium comprising a program stored therein that is installed in a control unit of an exposure device including a first wafer stage including a first wafer chuck which absorbs a semiconductor wafer, a second wafer stage for exposure including a second wafer chuck which absorbs said semiconductor wafer, a wafer moving mechanism which moves said semiconductor wafer, and said control unit which controls said wafer moving mechanism, said first wafer chuck, and said second wafer chuck, said program causes said control unit to perform, before an exposure process:
a process of allowing said first wafer chuck of said first wafer stage to absorb said semiconductor wafer to adjust the temperature of said semiconductor wafer;
a process of allowing said first wafer chuck to release said semiconductor wafer;
a process of allowing said wafer moving mechanism to move said semiconductor wafer over said first wafer stage to said second wafer stage; and
a process of allowing said second wafer chuck of said second wafer stage to absorb said semiconductor wafer.