Method of manufacturing through-via
AssigneeElectronics and Telecommunications Research Institute
InventorsJong-jin Lee, Hyun-seo Kang, Jai-sang Koh
Life of this patent
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Abstract
Disclosed is a method of manufacturing a through-via. The through-via manufacturing method includes forming a core-via hole in a wafer, forming a suction-via hole adjacent to the core-via hole in the wafer, forming a via core in the core-via hole, forming a polymer-via hole connected to the suction-via hole in the wafer, filling the polymer-via hole with polymer solution by creating a vacuum inside the polymer-via hole by drawing air out of the suction-via hole, and polishing the wafer such that the via core formed in the core-via hole is exposed.
Claims17
A method of manufacturing a through-via, the method comprising:
- forming a core-via hole in a wafer;
- forming a suction-via hole adjacent to the core-via hole in the wafer;
- forming a via core in the core-via hole;
- forming a polymer-via hole connected to the suction-via hole in the wafer;
- filling the polymer-via hole with polymer solution by creating a vacuum inside the polymer-via hole by drawing air out of the suction-via hole;
- and
- polishing the wafer such that the via core formed in the core-via hole is exposed.
Dependencies are inferred from the claim text.