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OwnerNaonori Akae, Masahiro Yonebayashi +2inventors
InventorsNaonori Akae, Masahiro Yonebayashi, Tsukasa Kamakura, Yoshiro Hirose
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A semiconductor device manufacturing method comprises the steps of loading a substrate into a processing chamber, mounting the substrate on a support tool in the processing chamber, processing the substrate mounted on the support tool by supplying process gas into the processing chamber, purging the interior of the processing chamber after the substrate processing step, and unloading the processed substrate from the processing chamber after the step of purging the interior of the processing chamber, wherein in the step of purging the interior of the processing chamber, exhaust is performed toward above the substrate and toward below the substrate in the processing chamber, and the exhaust rate toward above the substrate is set larger than the exhaust rate toward below the substrate.
A semiconductor device manufacturing method comprising the steps of:
A substrate processing apparatus comprising:
Dependencies are inferred from the claim text.