Working method for cutting
AssigneeHamamatsu Photonics K.K.
InventorsTakeshi Sakamoto, Hideki Shimoi, Naoki Uchiyama
Life of this patent
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Abstract
An object to be processed is reliably cut along a line to cut. An object to be processed is irradiated with laser light while locating a converging point at the object, so as to form a modified region in the object along a line to cut. The object formed with the modified region is subjected to an etching process utilizing an etching liquid exhibiting a higher etching rate for the modified region than for an unmodified region, so as to etch the modified region. This can etch the object selectively and rapidly along the line to cut by utilizing a higher etching rate in the modified region.
Claims10
A working method for cutting a planar object to be processed along a line to cut, the method comprising the steps of:
- irradiating the object with laser light while locating a converging point at the object, so as to form a modified region in the object along the line to cut;
- and
- thereafter etching the modified region formed along the line to cut by an etching process utilizing an etchant exhibiting a higher etching rate for the modified region than for an unmodified region.
A working method for cutting according to claim 1, wherein the step of forming the modified region forms a plurality of modified regions in a thickness direction of the object;
- and
- wherein the step of etching the modified region carries out the etching process such that at least one of the plurality of modified regions remains as a cutting modified region to become a base point for the cutting.
Dependencies are inferred from the claim text.