Microarray package with plated contact pedestals
AssigneeNational Semiconductor Corporation
InventorsJaime BAYAN, Nghia T. TU
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Abstract
A microarray package includes a leadframe having an array of contact posts, a die carried by the lead frame, and a plurality of bonding wires that electrically connect the die to the lead frame. An encapsulant is included that encapsulates the die, the bonding wire and the leadframe while leaving the distal ends of the contact posts exposed and substantially co-planar with a bottom surface of the microarray package. A plurality of pedestal members is plated to the distal end of a respective contact pad. A distal surface of each pedestal member protrudes outwardly beyond the bottom surface of the microarray package in the range of about 15 μm to about 35 μm.
Claims5
A method of packaging integrated circuits comprising:
- etching a first side of a metal sheet to define a lead frame panel having a plurality of device areas, each device area including an array of contact posts suitable for forming contact pads;
- attaching a plurality of dice to the lead frame, wherein each die is mounted on an associated device area;
- encapsulating the dice with an encapsulant material;
- exposing the contact pads of the contact posts in an orientation substantially co-planar with a bottom surface of the microarray package;
- and
- plating a pedestal member over the respective contact pad of one or more contact posts, said pedestal member protruding outwardly beyond the bottom surface of the microarray package by a height sufficiently displacing a respective stress concentration point at the one or more contact pads from a first respective solder bump interface contained substantially co-planar with the bottom surface.
Dependencies are inferred from the claim text.